I. Product Overview
The Ultra-High Resolution Field Emission Scanning Electron Microscope (FE-SEM) is a high-end micro-nano structure characterization instrument equipped with a field emission electron gun. Adopting a high-brightness, low-energy-spread field emission electron source, paired with an advanced electron optical system and ultra-stable vacuum environment, the instrument enables nanoscale and even sub-nanoscale imaging of sample surface morphology, microstructures and elemental distribution. Widely deployed in materials science, semiconductors, life sciences, advanced manufacturing and other sectors, FE-SEM serves as an indispensable core instrument for modern scientific research and high-end industrial analysis.
Technical Specifications
The ABN-MAGNA is an extremely powerful analytical instrument designed for morphological characterization and microscopic analysis of nanomaterials. Fitted with the Triglav™ SEM column, it delivers ultra-high resolution, and its in-column detector system features electronic signal filtering capability to deliver superior image contrast and surface sensitivity. It is perfectly suited for imaging non-conductive specimens such as ceramics, uncoated biological samples, and photosensitive semiconductor samples.
Equipped with a Schottky field emission electron gun capable of delivering beam current up to 400 nA, combined with the outstanding nanoscale analytical performance and stability of the Triglav™ SEM column, the MAGNA provides optimal conditions for microanalysis and long-duration sample analysis tasks.
High-Performance Tritens™ Triple Objective Lens System
The MAGNA integrates the patented Triglav™ SEM column built around the Trilens™ triple objective lens system, expanding its applicability across a broader range of fields.
TriSE™ & TriBE™ Detector Systems
The MAGNA is equipped with the latest-generation TriSE™ and TriBE™ detector systems, consisting of three secondary electron (SE) detectors and three backscattered electron (BSE) detectors that selectively collect signals based on differences in signal angle and energy.
The detector system selectively acquires signals by distinguishing signal angles and energy levels.It supports an electron beam current up to 400 nA with rapid accelerating voltage adjustment, while consistently delivering high-quality signals for all analytical applications.
Boasting exceptional detection performance under low beam energies, it is the ideal tool for characterizing seamless-surface biological specimens.
English Professional Translation (SEM/STEM industry standard terminology)
Black silicon doped with gold nanoparticles, imaged via In-Beam SE detector.
TiO₂ nanotubes, imaged with in-column SE detector.
Carbon nanotubes (~100 nm) decorated with 1–7 nm metallic nanoparticles; pseudo-color image rendered by differentiating various STEM signals after STEM imaging.
Synapses in brain tissue, imaged using in-column BSE detector.
II. Functional Features
Ultra-high spatial resolution imaging: Nanoscale and sub-nanoscale resolution is achievable even under low accelerating voltages.
Wide accelerating voltage range: Compatible with low-voltage surface imaging and high-voltage internal structure observation.
Multi-signal detection capability: Supports multiple imaging modes including secondary electron and backscattered electron detection.
Stable electron beam system: The field emission electron gun features high brightness, superior stability and long service life.
High-vacuum and expandable chamber design: Accommodates diverse sample testing requirements.
Intelligent operation interface: Equipped with auto-focus, automatic astigmatism correction and image stitching functions.
III. Application Scenarios & Fields
Materials Science: Morphology analysis of nanomaterials, 2D materials, composite materials and fracture surfaces.
Semiconductors & Integrated Circuits: Wafer defect inspection, line width measurement and failure analysis.
Life Sciences: Observation of ultrastructural surface features of cells, tissues and biological scaffolds.
Energy & Chemical Engineering: Microstructure analysis of catalysts and morphological characterization of battery electrode materials.
Advanced Manufacturing: Surface quality evaluation of precision machined parts and micro-nano structure inspection.
IV. Technical Advantages
Superior performance of field emission electron source: Narrow energy spread and high signal-to-noise ratio greatly improve image clarity.
High resolution at low accelerating voltages: Minimizes sample damage, ideal for non-conductive or beam-sensitive specimens.
Highly optimized electron optical system: Effectively reduces optical aberrations and enhances imaging stability.
Excellent system stability: Suitable for long-duration, high-repeatability research and inspection workflows.
Strong system expandability: Compatible with integration of EDS, multi-functional stages and various in-situ accessories.
V. Typical Models and Application Cases
Type | Positioning | Features | Application Cases |
UHR-FESEM-B（Basic research-oriented） | Routine nanostructure characterization for universities and research institutes, balancing high resolution and user-friendliness |
· Field emission electron gun (Schottky or cold field emission)
· High-resolution imaging capability under low accelerating voltage
· Secondary electron (SE) imaging as the primary mode
· Manual / semi-automatic sample stage
· Suitable for routine high-vacuum samples
|
· Observation of surface morphology of two-dimensional materials (e.g., graphene, transition metal dichalcogenides)
· Statistics on the size and morphology of nanopowders, nanowires and nanosheets
· Structural verification for teaching experiments and fundamental scientific research
· Analysis of surface roughness and continuity of thin films
|
UHR-FESEM-A（Enhanced Analysis） | Suitable for materials science, semiconductor and energy research, highlighting the collaborative capability of imaging and compositional analysis |
· High-stability field emission electron gun
· Multi-detector configuration (SE + BSE)
· Expandable energy dispersive spectroscopy (EDS) interface
· 5-axis or 6-axis high-precision sample stage
· Supports long-term stable imaging and analysis
|
· Analysis of Surface Defects and Particle Contamination on Semiconductor Wafers
· Research on Interfaces and Phase Distribution of Metal/Ceramic Composite Materials
· Analysis of Microstructure and Element Distribution of Cathode and Anode Materials for Batteries
· Characterization of Particle Size, Dispersibility and Agglomeration State of Catalysts
|
UHR-FESEM-P（High-end performance type） | For high-end scientific research and precision industrial inspection, highlighting ultimate resolution and system stability |
· Ultra-high brightness field emission electron source · Sub-nanometer spatial resolution capability · Ultra-high vacuum electron optical system · High-rigidity, low-drift sample stage · Supports a variety of in-situ or combined expansion interfaces
|
· Evaluation of Linewidth and Structural Integrity of Advanced Process Chips
· Structural Inspection of Nanodevices and Micro-Electro-Mechanical Systems (MEMS)
· Morphology Analysis of Atomic Steps, Grain Boundaries and Defects
· High-End Failure Analysis and Precision Quality Inspection
|
UHR-FESEM-LV（Low Voltage / Sensitive Sample Type） | Designed exclusively for non-conductive, biological or irradiation-sensitive samples, featuring low-damage and high-contrast imaging |
· Capability of stable imaging at ultra-low accelerating voltage · Optimized low-voltage electron optical system · Reduced sample charging and thermal damage · Suitable for samples requiring no or minimal gold sputtering
|
· Observation of microstructures on the surface of biological cells and tissues
· Analysis of surface morphology of polymers and soft materials
· Characterization of microporous structures of hydrogels and biological scaffolds
· Low-damage surface detection of coatings and thin films
|
Data chart
Appearance drawing
