The AMBER Ultra-High Resolution Gallium Ion FIB-SEM Atomic Force Microscopy Analysis System is a multi-functional micro-nano structural characterization and fabrication platform integrating Focused Ion Beam (FIB), Field Emission Scanning Electron Microscope (SEM) and Atomic Force Microscopy (AFM) technologies. Equipped with a high-brightness liquid gallium ion source and ultra-high resolution field emission electron optical system, the system delivers precise imaging, in-situ fabrication, 3D reconstruction and multi-physical parameter characterization across micrometer to nanometer scales, catering to the demands of cutting-edge scientific research and high-end industrial analysis.
The ABN-AMBER is an ultra-high resolution FIB-SEM system incorporating multiple innovative designs including the BrightBeam™ SEM column, Orage™ Ga FIB column and OptiG IS gas injection system. It achieves industry-leading performance in ultra-high resolution, expandable in-situ applications and comprehensive analytical capabilities. The first-generation Essence™ operating software bundled with AMBER greatly simplifies the user interface, enables instant access to core instrument functions, optimizes workflow layout for easy operation, and supports customized interface layouts tailored to different experimental requirements.
The newly developed in-chamber 3D spatial positioning drive function prevents collision risks during operation and effectively reduces equipment collisions.
SEM Resolution: 0.9 nm @ 15 kVFIB Resolution: < 2.5 nm @ 30 kV
Electron signals can be collected at various angles and energy levels to deliver superior surface imaging and contrast.Adopts an electrostatic-electromagnetic hybrid column with no stray magnetic field, making it highly suitable for observation and analysis of magnetic samples.Offers up to 30 aperture sizes, precisely driven by piezoelectric ceramics with fully repeatable, high-speed and high-precision switching.
Equipped with a large vacuum chamber featuring more than 20 expansion ports, providing an ideal working environment for in-situ observation and analysis.

Latex beads, imaged at 50 V.
Cross-section with a length of 50 μm fabricated on lithium battery anode.
Uncoated spores, imaged at 800 V.
Surface morphology of mouse tongue, Cryo-SEM imaging at 2 kV.
Ultra-high resolution field emission SEM imaging
High-precision gallium ion FIB micro-nano fabrication
In-situ 3D slicing and reconstruction
AFM characterization of nano-morphology and mechanical properties
Multi-mode collaborative analysis
Automated control and outstanding system stability
Failure analysis for semiconductors and integrated circuits
Research on 2D materials and nano-devices
Microstructure characterization of novel functional materials
Micro-nano processing and prototyping
Fine structure analysis of biological and soft materials
IV. Technical Advantages
1. Sub-nanometer imaging capability
2. High beam current stability and low-drift design
3. In-depth integration of multiple technologies including FIB-SEM-AFM
4. In-situ, non-transfer analysis
5. Highly scalable architecture for scientific research and industrial applications
Type | Positioning | Features | Application Cases |
AMBER-FIBSEM-200(Basic research-oriented) | Universal Ultra-High Resolution FIB-SEM Analysis Platform for Universities and Research Institutes | · High-brightness gallium ion source FIB, enabling precise cutting and cross-section preparation at micro and nano scales · Field emission SEM for nanoscale surface morphology observation · Compatible with basic in-situ cross-section analysis and two-dimensional imaging · Compact system structure with manageable maintenance and operation costs | · Laboratories related to materials science, physics, chemistry and microelectronics · Fundamental research on two-dimensional materials and nanostructures · Failure analysis of semiconductor devices |
AMBER-FIBSEM-300(Enhanced 3D Analysis) | High-performance Platform for 3D Structure Analysis and In-situ Characterization | · High-stability FIB-SEM dual-beam collaborative system · Supports automatic slicing and three-dimensional reconstruction (Slice & View) · Optimized electron optical system to improve resolution under low accelerating voltages · Enables continuous in-situ analysis of complex samples | · Research on Semiconductor Processes · 3D Characterization of Microstructures of Advanced Materials · Structural Analysis of Porous Materials and Composite Materials · 3D Structure Reconstruction of Nanoporous Materials · Research on Microstructures of Novel Functional Materials |
AMBER-FIBSEM-500(Multimodal Integrated) | High-end Customized Multimodal Micro-Nano Analysis and Processing Platform | · Deep integration of FIB-SEM and Atomic Force Microscopy (AFM) · Supports joint characterization of multiple physical parameters including morphology, mechanics and electricity · Suitable for in-situ analysis of complex devices and heterogeneous structures · Compatible with expansion of various detection and analysis modules | · Research on cutting-edge nano-devices · Failure analysis of high-end semiconductors · Research on comprehensive properties of multi-functional materials · Cross-sectional research of two-dimensional materials and heterojunctions · Defect localization and repair for micro-nano device fabrication |
Working principle diagram

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Company Address:
Huai'an (Headquarters): No. 7, Meigao Road, Qingpu Industrial Park, Qingjiangpu District, Huai'an City, Jiangsu Province
Suzhou: 4th Floor, Building D, China-Netherlands Innovation Harbor, No. 588 Xiangrong Road, Beihejing Sub-district, Xiangcheng District, Suzhou City, Jiangsu Province
Email:service@abner-nano.com
Contact Number: 13327968688 Mr. Yan

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