1. Product Overview

The UV Litho-ABN Master Mask Aligner adopts a high-stability UV light source and advanced optical system, delivering precise alignment between masks and samples to achieve high-fidelity pattern transfer at micron and submicron levels. It supports multiple exposure modes including contact and proximity exposure, compatible with substrates of various sizes and diverse photoresists. The equipment caters to scientific research, small-to-medium batch semiconductor manufacturing, micro-electro-mechanical systems (MEMS), optoelectronic devices and other fields. Equipped with a user-friendly operation interface and automatic control modules, it ensures stable and efficient exposure processes, and improves product yield and repeatability.

Technical Specifications

1. Light Source

• Light Source Type: High-intensity mercury lamp / 365nm i-line / LED (405nm optional)

• Light Intensity Stability: ±2%

• Light Intensity Density: ≥50 mW/cm² (at sample surface)

• Illumination Uniformity: ≥90%

2. Optical System

• Optical Design: Collimating lens + homogenizer system + exposure objective (projection or contact type)

• Optical Resolution: ≤2 μm (contact mode), ≤5 μm (proximity mode)

• Projection Magnification: 1:1 (unity magnification)

• Optical Adjustment: X-Y fine adjustment, Z-axis focusing, mask rotation correction supported

3. Exposure System

• Exposure Area: 25 mm × 25 mm (larger size customizable)

• Exposure Mode: Contact / Proximity (switchable)

• Exposure Time Control: 0.01 s – 60 s, step ≤ 0.01 s

• Mask Type: Standard glass mask (thickness: approx. 1 mm)

• Alignment System: High-magnification CCD alignment (crosshair and image overlay supported)

• Alignment Accuracy: ≤2 μm

4. Motion Platform

• Tabletop Dimension: 100 mm × 100 mm

• X/Y/Z Travel: 50 mm / 50 mm / ±5 mm (Z-axis for focusing)

• Platform Repeat Positioning Accuracy: ≤1 μm (equipped with high-precision guide rails and electric modules)

5. Control System

• Control Mode: Software control + touch screen control (parameter setting and manual operation available)

• Communication Interface: USB / RS232 / Ethernet (optional)

• Exposure Parameter Setting: Adjustable light intensity, exposure time and switching sequence

6. Mechanical Structure

• Equipment Dimension: Approx. 600 mm × 450 mm × 400 mm

• Housing Material: Anodized aluminum alloy / sprayed sheet metal

• Viewing Window: UV-protective acrylic window

7. Electrical & Environmental Requirements

• Power Supply: AC 220V, 50Hz, within 300W

• Operating Environment: Temperature 20–25℃, Humidity ＜60%

• Recommended Safety Measures for Clean Environment: UV protection, emergency stop switch, operation authority management

8. Optional Modules

• Automatic Mask Changer: Optional automatic mask replacement unit

• Automatic Alignment System: Automatic identification of alignment marks & image processing aided alignment

• Vacuum Chuck: For sample fixation to optimize contact performance

• Servo Electric Control Platform: High-speed & high-precision alignment control (nanometer-level accuracy)

Application Example: Lithography for MEMS Pressure Sensor Structure

• Substrate: 4-inch silicon wafer

• Minimum Line Width: 2 μm

• Application: Mass production of MEMS sensors

Example 2: Optical Microstructure Array

• Substrate: Fused silica glass

• Pattern Type: Grating / Microlens array

• Application: Optical modulation and imaging systems

II. Features

1. High-precision mask alignment system: Enables multi-dimensional precise alignment along X/Y/θ axes, with microscopic alignment and submicron repeat positioning capability.

2. Multiple exposure modes: Supports contact, proximity and projection exposure to meet diverse resolution and process requirements.

3. Stable and uniform exposure light source: Adopts high-stability UV LED or mercury lamp combined with homogenizing system to ensure consistent exposure energy.

4. Compatibility with various substrate sizes: Fits 2~6 inch wafers, glass, fused silica and flexible substrates.

5. Automatic exposure and time control: Programmable exposure time, intensity and modes for excellent process repeatability.

6. Quick mask replacement structure: Facilitates frequent process switching for research and small-batch production.

7. User-friendly HMI: Controlled via touch screen or PC; supports storage and recall of process parameters.

8. High-safety design: Equipped with door interlock, light source protection, fault alarm and emergency stop functions.

III. Application Scenarios & Fields

1. Semiconductors and Integrated Circuits: Fabrication of lithographic patterns such as microelectrodes, interconnects and test structures.

2. MEMS and Microsystems: Processing of micro-cantilevers, pressure sensors, accelerometers and other microstructures.

3. Microfluidics and Biochips: Manufacturing of microchannels, array structures and biosensing chips.

4. Optoelectronic and Optical Devices: Lithography for gratings, waveguides, microlens arrays and other optical structures.

5. Advanced & 2D Material Research: Patterning of electrodes, definition of device structures and prototype verification.

6. Teaching & Research Platforms: Ideal for experimental teaching and process development in universities and research institutes.

IV. Technical Advantages

1. High pattern transfer accuracy: Achieves exposure resolution at micron and even submicron levels.

2. Stable alignment precision: Excellent repeat alignment accuracy, suitable for multi-layer lithography processes.

3. Strong process compatibility: Compatible with various photoresists and substrate materials.

4. Stable and reliable equipment: High structural rigidity and long service life of the optical system.

5. High automation level: Reduces human errors and improves efficiency in research and production.

6. Good expandability: Supports upgrades of automatic alignment, automatic wafer loading/unloading and cleanroom modules.

V. Typical Application Cases

Table: Typical Application Cases of Mask Aligner

Note: The above configurations can be customized and adjusted according to users' experimental requirements.

Equipment Appearance Drawing